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RELIABILITY
Package Type
Test
Condition
D-PAK
MSL 1
HTRB
HTGB
THB
TC

- Reflow peak temp. 235°C
- 150°C @ 1000h
- 150°C @ 1000h
- 85°C / 85% @ 1000h
- -55°C ~ 150°C @ 5000 cycles
SOT-23

MSL 1
Autoclave
HTRB
HTGB
THB
TC
- Reflow peak temp. 235°C
- 121°C @ 96h
- 150°C @ 1000h
- 150°C @ 1000h
- 85°C / 85% @ 1000h
- -55°C ~ 150°C @ 1000 cycles
SOT-223


Autoclave
HTRB
HTGB
THB
TC
- 121°C @ 96h
- 150°C @ 1000h
- 150°C @ 1000h
- 85°C / 85% @ 1000h
- -55°C ~ 150°C @ 1000 cycle
 
 
  
 

LEAD FREE PROGRAM Lead

100% Matte Tin
Reflow Solderability Test
- No failure for both 240 deg C & 260 deg C
Whisker Simulation Test
- Temp Cycle (-65 to 150 Deg C): No whisker observed after 1000 cycles
- Storage at 85 deg C/85% humidity: No whisky observed after 168 hours
- Autoclave (121 Deg C; 2atm; 100% humidity): No whisker onserved after 168 hours
- High Temperature Storage @ 150 deg C for 1000 hours: No Solderability failure
Package MSL Level 1 Test
- 3/5/6L SOT23; SOT143; SOT223; 3/5L Dpak; 8/14/16L SOIC

GREEN COMPOUND
G600C - Sumitomo, GE-800 - Nitto, GE-19220 - Hitachi
Reflow Solderability Test
- No failure @ 240 deg C & 260 deg C
Package MSL Level 1 Test
- 3/5/6L SOT23; SOT143; SOT223; 3/5L Dpak; 8/14/16L SOIC